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In fabrication process for electric devices, high precision patterning on sheet substrates is required. To pattern with high precision, high precision positioning of the sheet to the target location is needed. On the other hand, a sheet is deformed locally and ununiformly by stress, temperature, humidity and so on. These sheet deformations may cause reduction of sheet positioning accuracy. Therefore, in sheet handling process, it's important to reduce and/or control these deformations. However, the state and the mechanism of these deformations are not clear. So, it's needed to measure and understand sheet deformation. In this research, we have developed a new apparatus which can measure the sheet deformation with high accuracy. The developed apparatus consists of four CCD cameras and laser height sensors fixed on a stiff frame. The measured sheet is previously patterned with the alignment marks at predefined pitch. This apparatus simultaneously detects some positions of the marks on the sheet by cameras and calculates sheet strain by the relative displacements among the marks. Furthermore, this apparatus can move above the sheet surface to measure at any place. We confirmed that this apparatus can measure sheet deformation at any place to an accuracy of a few micrometers. Furthermore, this apparatus can measure sheet deformation for perpendicular direction to the sheet surface with micrometer precision. We report the results of consideration for measuring method of sheet strain and the developed apparatus.

A new measurement method for micro deformation of sheet on handling processes (Development of an apparatus for measuring micro deformation)