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In order to determine the effect of triple junction on the crack initiation, we use the finite element method to investigate the effect of misorientation between Cu grains on the stress concentration near the triple junction in comparison to that near a free edge. The results reveal that the triple junction represents a greater danger for crack initiation than the free edge in nano-components over a wide range of grain combinations. The stress concentration near the triple junction is governed by the difference in stiffness between the grains. Thus, the combination of the stiffest and softest grains induces the highest stress concentration.

Crack initiation site at the interface between a nano-component and substrate