Study on a Multifin-Type Thermal Conductor for Cooling Heat Dissipating Components. 2nd Report. Prediction of Thermal Contact Resistance between a Heat-Dissipating Component and the Conductor. | Zendy

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Study on a Multifin-Type Thermal Conductor for Cooling Heat Dissipating Components. 2nd Report. Prediction of Thermal Contact Resistance between a Heat-Dissipating Component and the Conductor.

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