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This paper investigates the thermoelectromechanical interaction among multi parallel axisymmetric cracks in a piezoelectric material under a uniform heat flow far away from the crack region. The crack faces are supposed to be insulated thermally and electrically. By using the Hankel transform, the thermal and electromechanical problems are reduced to systems of singular integral equations, respectively. The singular integral equations are solved numerically by using the Gauss-Jacobi integration formula. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the thermoelectromechanical interaction on the stress and electric displacement intensity factors. From numerical results, we can find that the normalized stress and electric displacement intensity factors are under the great influence of the crack spacing and the number of cracks. Especially, the influence of the thermoelectromechanical interaction on the fracture behavior is complicated when the crack spacing becomes small.

Thermoelectromechanical Interaction among Multi Parallel Axisymmetric Cracks in a Piezoelectric Material