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In this paper, effect of adding porous Cu interlayer into Sn-0.3Ag-0.5Cu lead-free solder joint on the microstructure and the tensile strength were investigated. Porous Cu interlayer with different porosities of 15, 25 and 35 ppi were applied to join with Cu substrates by using Sn-0.3Ag-0.5Cu lead-free solder alloy. Soldering was conducted in a furnace with Argon gas flow. Two soldering temperatures of 267 oC and 287 oC with a soldering time of 60 s were applied. Soldering temperature of 267 oC was chosen in order to study effect of soldering time (60, 180 and 300 s) on strength and microstructure of the solder joint. Strength of the solder joint was evaluated by tensile test. Microstructure and fracture morphology were observed in order to understand the failure behavior of the joint. Results showed that tensile strength of the joint increased with increase in soldering temperature and porosity of the porous Cu interlayer. Penetration behavior of molten solder alloy into the porous Cu interlayer significantly influenced fracture morphology and strength of the joint.

532 Effect of adding porous Cu interlayer into Sn-Ag-Cu lead-free solder joint on microstructure and tensile strength