English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Currently, the flip chip package is one of the standard semiconductor packages in the world market. Also, there are variety of materials and configurations used in flip chip packages with further high performance or miniaturization. From the encapsulate materials point of view, many types of assembly methods are presently studied on a current standard process as well as novel proposed processes. A highly reliable package depends on properties of constituent. Additionally, there is a possibility that the assembly process to encapsulation affects the warpage behavior and reliability performance. The present paper reports the relationship between warpage and other parameters depending on not only the material properties but also the encapsulating process.

Reliability Evaluation of Warpage of Flip Chip Package with Some Kinds of Underfill Material