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An electromechanical impedance (EMI) analysis of a piezoelectric smart beam with a crack is implemented in this paper. Spectral element method (SEM) is used to analyze the EMI response of the piezoelectric smart beam. In this analysis, the spectral element stiffness matrices of different beam segments are derived in this paper. The crack is simulated using spring models, and the EMI signatures of piezoelectric smart beam with and without crack are calculated using SEM, respectively. From the analysis results, it is found that the peak position and amplitude of the EMI signatures have significant changes with the change in crack depth, especially in higher frequency ranges. Different vibration modes of the piezoelectric smart beam are analyzed, and the effect of thickness of the adhesive layer on the admittance is also researched. An experimental study is also implemented to verify the validity of the analysis results using SEM.

Electromechanical Impedance Analysis on Piezoelectric Smart Beam with a Crack Based on Spectral Element Method