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A low profile chip-package stacked-patch antenna is proposed by using low temperature cofired ceramic (LTCC) technology. The proposed antenna employs a stacked-patch to achieve two operating frequency bands and enhance the bandwidth. The height of the antenna is decreased to 4.09 mm (about λ /25 at 2.45 GHz) due to the shorted pin. The package is mounted on a 44 × 44 mm2 ground plane to miniaturize the volume of the system. The design parameters of the antenna and the effect of the antenna on chip-package cavity are carefully analyzed. The designed antenna operates at a center frequency of 2.45 GHz and its impedance bandwidth ( S 11 < - 10 d B ) is 200 MHz, resulting from two neighboring resonant frequencies at 2.41 and 2.51 GHz, respectively. The average gain across the frequency band is about 5.28 dBi.

Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology