English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

This paper focuses on the modeling method of common interconnects which act as coupling channels in the analysis of PCB immunity. Fast modeling and parameters extraction of power/ground plane pair are realized using cavity resonance method. The calculated results of the model match with the simulation results of HFSS within 9 GHz, which demonstrates the effectiveness of the modeling method. Besides, segmented via modeling method including the effect of power/ground plane pair is proposed. In this modeling method, via structure is decomposed into three parts, and each part is modeled, respectively. The modeling of single via and differential vias in single plane pair and multilayer is completed using this method. High accuracy is reached due to the adoption of the effect of power/ground plane pair and the adoption of second-order circuit model of capacitance and inductance, where the parameters can be gotten from analytic formulas. Finally, considering an actual signal network, for example, the equivalent circuit model of the network, is established, and every part of the equivalent circuit model is imported into Designer for cosimulation. The results are consistent with the simulation results of HFSS within 9 GHz

A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair