Open AccessAspects of Bonding Processed CMOS Wafers
Author(s) -
Roy Knechtel
Publication year - 2008
Publication title -
ecs meeting abstracts
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2008-02/33/2178
Subject(s) - wafer , cmos , wafer bonding , materials science , optoelectronics
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