Open AccessTheoretical Analysis of Thermally Induced Structural Deformation and Relaxation of Silicon Wafer
Author(s) -
Bipin Kumar,
Shantanu Roy,
J. A. Pitney,
Tom Torack,
Swapnil Dhumal,
Srikanth Kommu
Publication year - 2008
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2008-02/26/2003
Subject(s) - wafer , materials science , deformation (meteorology) , silicon , relaxation (psychology) , engineering physics , composite material , optoelectronics , forensic engineering , engineering , psychology , neuroscience
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