Open AccessEtching of Ti/W Alloy for Definition of Under Bump Metallurgy (UBM) on Semiconductor Wafers
Author(s) -
Krystyna W. Semkow,
C. H. Bailey,
D.L. Rath,
R Werner,
Hsichang Liu,
B. Sundlof
Publication year - 2007
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2007-01/18/865
Subject(s) - wafer , materials science , alloy , metallurgy , etching (microfabrication) , semiconductor , optoelectronics , composite material , layer (electronics)
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