Effect of Oxidizer on the Galvanic Behavior of Cu/Ta Couple in the Chemical-Mechanical Polishing
Author(s) -
WenTa Tsai,
JuiChin Chen
Publication year - 2006
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2005-01/6/318
Subject(s) - polishing , galvanic cell , chemical mechanical planarization , metallurgy , materials science
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