Open AccessOptically Probing Damascene Cu Seed and Core for Smoothness and Grain-sizing
Author(s) -
Gary D. Knight,
T. Smy
Publication year - 2006
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2005-01/15/704
Subject(s) - copper interconnect , sizing , materials science , core (optical fiber) , copper , metallurgy , composite material , chemistry , organic chemistry
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