Open AccessLow- and High- Temperature Silicon Wafer Direct Bonding for Micro- Machined Absolute Pressure Sensors
Author(s) -
Roy Knechtel,
Gerald Dahlmann,
Uwe Schwarz
Publication year - 2006
Publication title -
ecs meeting abstracts
Language(s) - English
Resource type - Journals
eISSN - 2151-2035
pISSN - 1091-8213
DOI - 10.1149/ma2005-01/11/497
Subject(s) - wafer , materials science , direct bonding , silicon , wafer bonding , absolute (philosophy) , optoelectronics , composite material , mechanical engineering , engineering , philosophy , epistemology
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