English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

SPICE-based interconnection simulation is described for multiple coupled lines and for lines with three- dimensional discont inuit ies. Two- and threedimensional finite element methods are presented for the quasi-TEM analysis of arbitrary interconnection structures. Partial capacitance and partial induct ante values for three-dimensional discontinuities are obtained by defining input and output ports for the discontinuity and deembedding the two-dimensional regions to the plane of the discontinuity. This procedures is highly accurate and reliable and can be used to model arbitrary interconnect geometries. Interconnection circuits are entered via geometric CAD and are meshed and solved automatically by using adaptive mesh generation. Equivalent circuit models of typical 3D interconnects such as bends, vias, T junctions and chip packages are described. Simulations are based on modal decomposition for multiple lines implemented using SPICE. We show that the quasiTEM analysis and the full wave analysis of a Tjunction are nearly identical up to 10 GHz. parameters. It is not clear when quasi-TEM analysis is valid and when full-wave analysis is required. This paper presents a new approach to interconnection simulation. The approach uses the finite element method to compute electromagnetic fields and allows any threedimensional interconnection structure to be modeled accurately. It introduces a new definition and a new method of computing partial inductances and partial capacitances for three-dimensional interconnects. It examines the range of validity of the quasi-TEM approximation and demonstrates by using both full-wave and quasi-TEM analysis that quasi-TEM is accurate for a T-junction circuit up to 10 GHz. Finally, we show how to model multiple coupled lines correctly in SPICE even though SPICE directly supports only single conductor transmission lines.

High-speed interconnect modeling and high-accuracy simulation using SPICE and finite element methods