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The electrical resistivity and the anisotropic magnetoresistance (AMR) wasinvestigated for Ni Co alloys at and below room temperature. The Ni Co alloylayers having a thickness of about 2 um were prepared by electrodeposition onSi wafers with evaporated Cr and Cu underlayers. The alloy composition wasvaried in the whole concentration range by varying the ratio of Ni sulfate andCo sulfate in the electrolyte. The Ni Co alloy deposits were investigated firstin the as deposited state on the substrates and then, by mechanically strippingthem from the substrates, as self supporting layers both without and afterannealing. According to an X ray diffraction study, a strongly textured facecentered cubic (fcc) structure was formed in the as deposited state with anaverage grain size of about 10 nm. Upon annealing, the crystal structure wasretained whereas the grain size increased by a factor of 3 to 5, depending onalloy composition. The zero field resistivity decreased strongly by annealingdue to the increased grain size. The annealing hardly changed the AMR below 50at.% Co but strongly decreased it above this concentration. The compositiondependence of the resistivity and the AMR of the annealed Ni Co alloy depositswas in good quantitative agreement with the available literature data both at13 K and at room temperature. Both transport parameters were found to exhibit apronounced maximum in the composition range between 20 and 30 at.% Co and thedata of the Ni Co alloys fit well to the limiting values of the pure componentmetals (fcc Ni and fcc Co). The only theoretical calculation reported formerlyon fcc Ni Co alloys yielded at T=0K a resistivity value smaller by a factor of5 and an AMR value larger by a factor of about 2 than the corresponding lowtemperature experimental data, although the theoretical results properlyreproduced the composition dependence of both quantities.

Temperature dependence of the electrical resistivity and the anisotropic magnetoresistance (AMR) of electrodeposited Ni Co alloys