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Mask manufacturing for the approaching 90nm and 65nm nodes increasingly deploys variable shaped beam (VSB) mask writing machines. This has led to high interest in the fracturing methods which are at the heart of layout data preparation for VSB mask writing. In this paper, we set out the main requirements for fracturing and suggest a new solution approach based on integer linear programming (ILP). The main advantage of the new method is that the ILP flnds optimal solutions while being ∞exible enough to take into account all specifled requirements. We also suggest several decomposition (polygon partitioning) heuristics which speed up the ILP approach. Experimental comparisons with leading industry tools show signiflcant improvement in quality, as well as acceptable scalability, of the proposed methods. In particular, our fracturing solutions reduce shot count (which re∞ects write time and mask cost) and dramatically reduce sliver count (which re∞ects the risk of mask critical-dimension errors). Our results reveal signiflcant headroom that can be exploited by future design-to-mask tools to reduce the manufacturing variability and cost of IC designs.

Yield- and cost-driven fracturing for variable shaped-beam mask writing