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A folding nonblocking 4 X 4 optical matrix switch in simplified-tree architecture was designed and fabricated on a silicon-on-insulator wafer. To compress chip size, switch elements (SEs) were connected by total internal reflection mirrors instead of conventional S-bends. For obtaining smooth interfaces, potassium hydroxide (KOH) anisotropic chemical etching of silicon was employed. The device has a compact size of 20 X 3.2 mm(2) and a fast response of 8 +/- 1 mu s. Power consumption of 2 x 2 SE and excess loss per mirror were 145 mW and -1.1 dB, respectively. (c) 2005 Society of Photo-Optical Instrumentation Engineers.

optical engineering

Design and fabrication of compact nonblocking &lt;inline-formula&gt;&lt;math display="inline" altimg="none" overflow="scroll"&gt;&lt;mn&gt;4&lt;/mn&gt;&lt;mo&gt;×&lt;/mo&gt;&lt;mn&gt;4&lt;/mn&gt;&lt;/math&gt;&lt;/inline-formula&gt; optical matrix switch on silicon-on-insulator by anisotropic chemical etching