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Poly(chlorotrifluoroethylene) (PCTFE) and other fluoropolymers are increasingly used as inner layer dielectrics. However, these polymers have low surface energies and correspondingly poor adhesive properties. Results are presented on the use of a low-pressure ammonia plasma to enhance the surface bondability of PCTFE. The plasma modified PCTFE film surfaces were characterized by x-ray photoelectron spectroscopy and contact angle measurements. Surface modified films exhibited improved adhesion to electroless copper deposits (180° peel test) compared to coated PCTFE controls and that underwent no plasma exposure. Annealing studies were conducted between 30 and 100 °C to examine the stability of the plasma-modified surfaces. For samples annealed below Tg, contact angle measurements indicated that the plasma-introduced groups remained bound on the surface for four weeks. For specimens annealed above Tg, the surface functionalities were absorbed within the bulk and surface rearrangement occurred within 10 h of...

Transience of plasma surface modification as an adhesion promoter for polychlorotrifluorethylene