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Li, Yiran M.S.M.E., Purdue University, August 2016. The Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy. Major Professor: Ganesh Subbarayan, School of Mechanical Engineering. In microelectronic assemblies, solder joints serve as interconnection between different packaging levels and are an important cause for the failure of microelectronic products. Sn-Ag-Cu solder alloys became important after lead-based solder alloys were caused to be discarded by regulations in European Union and Japan. However, the constitutive behavior of Sn-Ag-Cu alloys is not as well understood as lead-based solder alloys, and many studies confirm the aging of these alloys with time. The aging of Sn-Ag-Cu alloys and its effect on mechanical behavior challenges the reliability prediction of microelectronic assemblies. In this study, the effect of pretest isothermal aging and in-test aging on the fatigue behavior of Sn3.0Ag0.5Cu alloy are examined using the microstructurally adaptive creep model (MACM) and the maximum entropy fracture model (MEFM). In this thesis, first, the development of microstructurally adaptive creep model is reviewed. Compared to traditional constitutive models, this model considers the effect of thermal history. Two microstructural parameters, the average Ag3Sn particles size and the average primary-Sn cell size are identified as critical parameters and incorporated into a modified Dorn creep form, which can describe both climb-controlled and glide-controlled dislocation motions. Next, the maximum entropy fracture model is discussed and compared to traditional fatigue fracture models. The MEFM utilizes the damage accumulation parameter kψ, which connects the accumulated damage to the accumulated inelastic dissipation. This parameter is independent of sample geometry, test temperature and strain rate.