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Thermal conductivity and interfacial thermal conductance play crucial rolesin the design of engineering systems where temperature and thermal stress areof concerns. To date, a variety of measurement techniques are available forboth bulk and thin film solid-state materials with a broad temperature range.For thermal characterization of bulk material, the steady-state absolutemethod, laser flash diffusivity method, and transient plane source method aremost used. For thin film measurement, the 3{\omega} method and transientthermoreflectance technique including both frequency-domain and time-domainanalysis are employed widely. This work reviews several most commonly usedmeasurement techniques. In general, it is a very challenging task to determinethermal conductivity and interface contact resistance with less than 5% error.Selecting a specific measurement technique to characterize thermal propertiesneed to be based on: 1) knowledge on the sample whose thermophysical propertiesis to be determined, including the sample geometry and size, and preparationmethod; 2) understanding of fundamentals and procedures of the testingtechnique and equipment, for example, some techniques are limited to sampleswith specific geometrics and some are limited to specific range ofthermophysical properties; 3) understanding of the potential error sourceswhich might affect the final results, for example, the convection and radiationheat losses.

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials