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On-chip inductive buck converters gain popularity due to their higher efficiency at higher load currents compared to its linear and capacitive counterparts. Through-silicon-via inductors (TSV-Inductors) in 3-D integrated circuit (3-D IC) technology can be used for the buck converter implementation that reduces the metal resource consumption of the inductor. However, in 3-D ICs, the regulated volta...

Single-Inductor–Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery