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It is anticipated that ubiquitous computer vision (CV) and artificial intelligence (AI) applications used on mobile devices will grow significantly. Such applications require battery-powered, always-on mobile devices to support indoor/outdoor, day/night usages. A global shutter (GS), stacked digital pixel sensor (DPS) is a promising candidate to meet such requirements because of its potential for ultralow-power, ultrahigh dynamic range (HDR), and a small form factor. This article presents a prototype 4.0-<inline-formula> <tex-math notation="LaTeX">${\mu } \text{m}$ </tex-math></inline-formula> stacked DPS operating in its dual quantization (2Q) to realize HDR. The 4.0-<inline-formula> <tex-math notation="LaTeX">${\mu }\text{m}$ </tex-math></inline-formula> DPS pixel is formed with two layers, a backside illuminated pinned photodiode (PD) pixel on the top layer and an in-pixel analog-to-digital conversion (ADC) circuit with 9-bit static random access memory (SRAM) on the bottom layer. A Cu-to-Cu hybrid bonding (HB) technology is used to connect the two layers via pixel-level interconnect. In the 2Q scheme, a time-stamp (TS) quantization and a linear ADC are performed sequentially in the same frame, which extends the dynamic range (DR) with a small number of ADC bits of 9. The DPS with a 1024 <inline-formula> <tex-math notation="LaTeX">$\times$ </tex-math></inline-formula> 832 pixel array has achieved a single-exposure ultra HDR of 107 dB in a single frame. The nonlinear conversion characteristic of the TS mode provides an equivalent full well capacity (FWC) of 2000ke<sup>&#x2212;</sup>, while the noise floor in the linear ADC mode is 8.3e<sup>&#x2212;</sup>.

A 4.0 μm Stacked Digital Pixel Sensor Operating in a Dual Quantization Mode for High Dynamic Range