English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

In this article, single-layer intrinsic and fluorinated graphene were investigated as gate insertion layers in normally-OFF p-gallium nitride (GaN) gate high electron mobility transistors (HEMTs), which wraps around the bottom of the gate forming Ti/graphene/p-GaN at the bottom and Ti/graphene/SiNx on the two sides. Compared to the Au/Ti/p-GaN HEMTs without graphene, the insertion of graphene can increase the ION/IOFF ratios by a factor of 50, increase the VTH by 0.30 V and reduce the OFF-state gate leakage by 50 times. Additionally, this novel gate structure has better thermal stability. After thermal annealing at 350 &#x00B0;C, gate breakdown voltage (BV) holds at 12.1 V. This is considered to be a result of the 0.24 eV increase in Schottky barrier height and the better quality of the Ti/graphene/p-GaN and Ti/graphene/SiNx interfaces. This approach is very effective in improving the ION/IOFF ratio and gate BV of normally-OFF GaN HEMTs.

Gate Leakage Suppression and Breakdown Voltage Enhancement in p-GaN HEMTs Using Metal/Graphene Gates