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This article reports the design, fabrication, and demonstration of additively manufactured air jet impingement coolers for the thermal management of high-power gallium nitride (GaN) transistors. The polymer jet coolers impinge high-speed airflow with a velocity of 42-195 m/s (Reynolds number between 1.87&#x00D7;104 and 8.77&#x00D7;104) onto working GaN devices mounted on a printed circuit board (PCB). The air jet provides cooling heat fluxes of up to 58.4 W/cm2, cooling rates of up to 6.6 &#x00B0;C/s, and convective heat transfer coefficient ranging from 5.2 to 17.0 kW/(m2&#x00B7;K). The cooling performance is comparable to that of jet coolers made from other materials and manufacturing technologies. A key benefit of additive manufacturing (AM) is design freedom and geometric complexity, which we highlight by demonstrating three different packaging configurations, each enabled by a different jet cooler design that is customized for different types of packaging configurations: Cooler 1 directs two parallel impinging jets onto the top side of two devices; cooler 2 directs two air jets onto the front side and two air jets onto the back side of two devices; and cooler 3 directs air jets onto the front side of four devices mounted on parallel adjacent circuit boards. The second benefit of AM is the ability to consolidate multiple components into a single part, which we highlight by combining a nozzle, a fluidic delivery system, and a flow distributor within a volume of 80 mm &#x00D7; 80 mm &#x00D7; 100 mm. This work demonstrates the potential of AM to create complex, lightweight, fluidic delivery systems to achieve thermally and hydrodynamically optimized air jet cooling for high-power-density electronic devices.

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles