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Moore's law for traditional electric integrated circuits is facing increasingly more challenges in both physics and economics. Among those challenges is the fact that the bandwidth per compute on the chip is dropping, whereas the energy needed for data movement keeps rising. We benchmark various interconnect technologies, including electrical, photonic, and plasmonic options. We contrast them with hybrid photonic-plasmonic interconnect(s) [HyPPI(s)], where we consider plasmonics for active manipulation devices and photonics for passive propagation integrated circuit elements and further propose another novel hybrid link that utilizes an on-chip laser for intrinsic modulation, thus bypassing electrooptic modulation. Our analysis shows that such hybridization will overcome the shortcomings of both pure photonic and plasmonic links. Furthermore, it shows superiority in a variety of performance parameters such as point-to-point latency, energy efficiency, throughput, energy delay product, crosstalk coupling length, and bit flow density, which is a new metric that we defined to reveal the tradeoff between the footprint and performance. Our proposed HyPPIs show significantly superior performance compared with other links.

The Case for Hybrid Photonic Plasmonic Interconnects (HyPPIs): Low-Latency Energy-and-Area-Efficient On-Chip Interconnects