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Recent research has shown that die yield, test effectiveness, and early life reliability of integrated circuits are closely interrelated because of the common underlying statistics governing the distribution defects on semiconductor wafers. An understanding of these relationships can allow test effort, including burn-in screening, to be weighted in favor of sub population of dies with the highest expected failure rates. Consequently, the lowest possible defect levels (DPM) and field failure rates can be achieved at minimum overall test costs. This tutorial will introduce statistical yieldreliability models and show how they can be used for test optimization. Tutorial Track A: Design for Yield Optimization and Test Chair and Moderator: Yervant Zorian, LogicVision

Integrating Yield, Test and Reliability: "Statistical Models with Applications to Test and Burn-in Optimization"