English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

As technology scales down, the static power is expected to become a significant fraction of the total power. The exponential dependence of static power with the operating temperature makes the thermal profile estimation of high-performance IC a key issue to compute the total power dissipated in the next-generation. In this paper we present accurate and compact analytical models to estimate the static power dissipation and the temperature of operation of CMOS gates. The models are the fundamentals of a performance estimation tool in which numerical procedures are avoided for any computation to set a faster estimation and optimization. The models developed are compared to measurements and SPICE simulations for a 0.12 /spl mu/m technology showing excellent results.

A fast concurrent power-thermal model for sub-100 nm digital ICs