English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Interconnect structure, as the weak point of reliability, is often the critical part in electronic devices during their service. In order to monitor the health state and degradation of interconnect structure, the charging time is used as the health indicator for interconnect structure of QFP package in this paper. Firstly, a monitoring circuit, based on the proposed electrical model of interconnect structure, is designed to measure the charging time in real time. Secondly, the equivalent circuit of the monitoring circuit is derived and the effect of the parameters of the monitoring circuit on the charging time is analyzed. Then, experiments under vibration and steady temperature are conducted to analyze the failure of interconnect structure and derive the damage model. Finally, the effect of charging time as the health indicator to monitor the damage of interconnection structures is analyzed and the uncertainty is discussed. Results show that the charging time is directly related to the interconnect damage and can well characterize the interconnect failure, which can be used as a health indicator to assess the damage and predict the failure of interconnect structure.

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature