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The development of mobile communication sets higher demands on high frequency surface acoustic wave (SAW) devices. The layout of interdigital transducers (IDT) in SAW devices is in plane and the traditional methods of improving frequency for SAW devices are the increase of acoustic velocity and the reduction of wavelength. However, these methods have a limit due to the limited acoustic velocity and the photolithography limit. This work proposes a new way for the development of high frequency SAW devices by redesigning the layout of IDT in three dimensions (3D). The set of IDTs is split into two layers, i.e. the ground electrodes on one layer and the signal electrodes on the other layer. This 3D layout of IDTs dramatically narrows the horizontal gap between two adjacent electrodes, which can significantly increase the frequency. The frequency and the electromechanical coupling factor (K<sup>2</sup>) of the four structures of SAW devices with the 3D layout of IDTs were studied by the finite element method (FEM). The results show that the frequency can be doubled under the same critical resolution of lithography due to the shortening of wavelength, and the 3D layout of IDTs is available for SAW devices based on piezoelectric thin film or piezoelectric single crystal. This work develops a new alternative to increase the working frequency of SAW devices.

3D Layout of Interdigital Transducers for High Frequency Surface Acoustic Wave Devices