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A low cost, broadband and compact antenna in package solution (AiP) is proposed for 60 GHz low-power radar sensor applications. Following a glass integrated passive device (Glass-IPD) manufacturing process, a compact low cost taper slot antenna (TSA) is designed on a substrate with a thickness beyond Yngvesson&#x2019;s range. To realize high gain and front-to-back ratio, the antenna is optimized by introducing a truncated ground. A <inline-formula> <tex-math notation="LaTeX">$1 \times 2$ </tex-math></inline-formula> antenna array prototype is realized with a dummy transmission line chip in the dimension of <inline-formula> <tex-math notation="LaTeX">$5 \times 7.4$ </tex-math></inline-formula> mm<sup>2</sup>. Including the flip chip interconnect, the measured results demonstrate a 10 dB impedance bandwidth of <inline-formula> <tex-math notation="LaTeX">$47.2 \sim 67$ </tex-math></inline-formula> GHz. The calculated gain is higher than 6.5 dBi in the end-fire direction over the entire 60 GHz band. Based on a physical RLC equivalent circuit, by co-design of the antenna with solder balls, the flip chip interconnect is compensated with a passive network. For the compensation network, its working bandwidth is from 0.1 to 67 GHz, while its insertion loss at 60 GHz is less than 0.2 dB.

A 1 × 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors