English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

We design a 1 x 8 highly sensitive ultra-compact on-chip integrated sensor array consisting of a 1 x 8 power splitter, eight one-dimensional photonic crystal slot nanobeam cavities (1DPC-SNCs) connected by additional 1D photonic crystal tapered nanobeam bandgap filters (1DPC-TNBF), and an 8 x 1 power combiner. The performance of the device is numerically demonstrated by three-dimensional finite difference-time-domain (3D-FDTD) method. The whole structure is lying on top of a 2 &#x03BC;m buried silicon oxide layer, while remaining high sensitivities (over 400 nm/RIU) of the eight sensors, simultaneously. The proposed 1DPC-SNCs can reach a high-quality factor of 3.6 x 105. On account of the additional band-stop filters and the 8 x 1 power combiner, eight sensing segments interrogated simultaneously by one input and one output port is realized, with the ultra-compact footprint of 64x16 &#x03BC;m2 (26x16 &#x03BC;m2 in sensing region). Therefore, this design is a promising platform for realizing large-scale photonic integrated circuits with high integration density, especially for ultra-compact multiple on-chip sensing.

ieee access

Highly Sensitive 1 &#x00D7; 8 Parallel Multiplexing of Ultra-Compact Integrated 1D Photonic Crystal Sensor Array Based on Silicon-on-Insulator Platform