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This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree <inline-formula> <tex-math notation="LaTeX">$(\alpha)$ </tex-math></inline-formula> relationship between curing temperature <inline-formula> <tex-math notation="LaTeX">$T$ </tex-math></inline-formula> and curing time <inline-formula> <tex-math notation="LaTeX">$t$ </tex-math></inline-formula> is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging.

ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints