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The timescale of electronic cooling is an important parameter controlling theperformance of devices based on quantum materials for optoelectronic,thermoelectric and thermal management applications. In most conventionalmaterials, cooling proceeds via the emission of phonons, a relatively slowprocess that can bottleneck the carrier relaxation dynamics, thus degrading thedevice performance. Here we present the theory of near-field radiative heattransfer, that occurs when a two-dimensional electron system is coupled via thenon-retarded Coulomb interaction to a three-dimensional bulk that can behave asa very efficient electronic heat sink. We apply our theory to study the coolingdynamics of surface states of three dimensional topological insulators, and ofgraphene in proximity to small-gap bulk materials. The ``Coulomb cooling'' weintroduce is alternative to the conventional phonon-mediated cooling, can bevery efficient and dominate the cooling dynamics under certain circumstances.We show that this cooling mechanism can lead to a sub-picosecond time scale,significantly faster than the cooling dynamics normally observed in Diracmaterials.

Ultrafast electronic heat dissipation through surface-to-bulk Coulomb coupling in quantum materials