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Nanoscale solid-solid contacts define a wealth of material behaviours fromthe electrical and thermal conductivity in modern electronic devices tofriction and losses in micro- and nanoelectromechanical systems. For modernultra-high integration processor chips, power electronic devices andthermoelectrics one of the most essential, but thus far most challenging,aspects is the assessment of the heat transport at the nanoscale sizedinterfaces between their components. While this can be effectively addressed bya scanning thermal microscopy, or SThM, which demonstrates the highest spatialresolution to thermal transport to date, SThM quantitative capability isundermined by the poorly defined nature of the nanoscale contact between theprobe tip and the sample. Here we show that simultaneous measurements of theshear force and the heat flow in the probe-sample junction shows distinctcorrelation between thermal conductance and maximal shear force in the junctionfor multiple probe-material combinations. Quantitative analysis of thiscorrelation confirmed the intrinsic ballistic nature of the heat transport inthe tip-surface nanoscale contact suggesting that they are, ultimately,composed of near-atomic sized regions.  Furthermore, in analogy to the Wiedemann-Franz law, which links electricaland thermal conductivity in metals, we suggest and experimentally confirm ageneral relation that links shear strength and thermal conductance in nanoscalecontacts via the fundamental material properties of heat capacity and heatcarrier group velocity, thus opening new avenues for quantitative explorationof thermal transport on the nanoscale.

Shear Forces and Heat Conductance in Nanoscale Junctions