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The new generation internal beam dump of the Super Proton Synchrotron (SPS)at CERN will have to dissipate approximately 270 kW of thermal power, depositedby the primary proton beam. For this purpose, it is essential that the coolingsystem features a very efficient heat evacuation. Diffusion bonding assisted byHot Isostatic Pressing (HIP) was identified as a promising method of joiningthe cooling circuits and the materials of the dump's core in order to maximisethe heat transfer efficiency. This paper presents the investigation of HIPassisted diffusion bonding between two CuCr1Zr blanks enclosing SS 316L tubesand the realisation of a real size prototype of one of the dump's coolingplate, as well as the assessments of its cooling performance under the dumpsmost critical operational scenarios. Energy-dispersive X-ray (EDX)spectroscopy, microstructural analyses, measurements of thermal conductivityand mechanical strength were performed to characterize the HIP diffusion bondedinterfaces (CuCr1Zr-CuCr1Zr and CuCr1Zr-SS316L). A test bench allowed to assessthe cooling performance of the real size prototype. At the bonded interface,the presence of typical diffusional phenomena was observed. Moreover, measuredtensile strength and thermal conductivity were at least equivalent to thelowest ones of the materials assembled and comparable to its bulk properties,meaning that a good bonding quality was achieved. Finally, the real sizeprototype was successfully tested with an ad-hoc thermal test bench and withthe highest operational thermal power expected in the new generation SPSinternal beam dump.

physical review. accelerators and beams

Hot Isostatic Pressing (HIP) assisted diffusion bonding between CuCr1Zr  and AISI 316L for application to the Super Proton Synchrotron (SPS) internal  beam dump at CERN