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The ALICE Inner Tracking System has been recently upgraded to a full silicondetector consisting entirely of MAPS, arranged in seven concentric layersaround the LHC beam pipe. Further ahead, during the LHC Long Shutdown 3, theALICE collaboration is planning to replace the three innermost layers of thisnew ITS with a novel vertex detector. The proposed design features wafer-scale,ultra-thin, truly cylindrical MAPS. The new sensors will be thinned down to20-40~{\textmu}m, featuring a material budget of less than0.05\%~x/$\mathrm{X_{0}}$ per layer, unprecedented low, and will be arrangedconcentrically around the beam pipe, as close as 18~mm from the interactionpoint. Anticipating the first prototypes in the new 65~nm CMOS technology node,an active R\&D programme is underway to test the response to bending ofexisting 50~{\textmu}m thick ALPIDE sensors. A number of such chips weresuccessfully bent, even below the targeted innermost radius, without signs ofmechanical damage, while retaining their full electrical functionality inlaboratory tests. The curved detectors were subsequently tested during particlebeam campaigns, where their particle detection performance was assessed. Inthis contribution, testbeam highlights from the data analysis of bent ALPIDEsensors, will be presented. It was proved that the current ALPIDE produced inthe 180~nm CMOS technology retains its properties after bending. The resultsshow an inefficiency that is generally below $10^{-4}$, independent of theinclination and position of the impinging beam with respect to the sensorsurface. This encouraging outcome proves that the use of curved MAPS is anexciting possibility for future silicon detector designs, as not only thesensor can survive the bending exercise mechanically, but the enticingattributes that make it attractive for use in the inner tracking layers arecomparable to the flat state.

Testbeam performance results of bent ALPIDE Monolithic Active Pixel Sensors in view of the ALICE Inner Tracking System 3