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For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector,consisting of silicon pixel, silicon strip and transition radiationsub-detectors, will be replaced with an all new 100 % silicon tracker, composedof a pixel tracker at inner radii and a strip tracker at outer radii. Thefuture ATLAS strip tracker will include 11,000 silicon sensor modules in thecentral region (barrel) and 7,000 modules in the forward region (end-caps),which are foreseen to be constructed over a period of 3.5 years. Theconstruction of each module consists of a series of assembly and qualitycontrol steps, which were engineered to be identical for all production sites.In order to develop the tooling and procedures for assembly and testing ofthese modules, two series of major prototyping programs were conducted: anearly program using readout chips designed using a 250 nm fabrication process(ABCN-25) and a subsequent program using a follow-up chip set made using 130 nmprocessing (ABC130 and HCC130 chips). This second generation of readout chipswas used for an extensive prototyping program that produced around 100barrel-type modules and contributed significantly to the development of thefinal module layout. This paper gives an overview of the components used inABC130 barrel modules, their assembly procedure and findings resulting fromtheir tests.

The ABC130 barrel module prototyping programme for the ATLAS strip tracker