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There has been an increasing interest in developing low temperature interconnection process using metal nanoparticles. In this study the Ag nanoparticles (NPs) for this low temperature bonding process applications were prepared based on the polyol method using polyvinylpyrrolidone (PVP) as the protecting agent. The effect of PVP on the Ag nanoparticle size, nanoparticle solution viscosity and the bondability of the Ag nanoparticle paste were studied. The silver nanoparticle with diameter of 90 nm, 40 nm and 20 nm were synthesized by adjusting PVP concentration. The bonding processes using different kind of Ag nanoparticle paste were conducted. The joint with shear strength of 50 MPa were formed using Ag nanoparticle (NP) paste prepared with appropriate PVP concentration.

Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application