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Exploring the mechanism of interfacial thermal transport and reducing theinterfacial thermal resistance is of great importance for thermal managementand modulation. Herein, the interfacial thermal resistance between overlappedgraphene nanoribbons is largely reduced by adding bonded carbon chains byperforming molecular dynamics simulations. And the analytical model(cross-interface model, CIM) is utilized to analyze and explain thetwo-dimensional thermal transport mechanism at cross-interface. An order ofmagnitude reduction in interfacial thermal resistance is found as the graphenenanoribbons are bonded by just one carbon chain. Interestingly, the decreasingrate of interfacial thermal resistance slows down gradually with the increasingof the number of carbon chains, which can be explained by the proposedtheoretical relationship based on CIM. Moreover, by the comparison of CIM andtraditional simplified model, the accuracy of CIM is verified and demonstratedin overlapped graphene nanoribbons. This work provides a new way to improve theinterfacial thermal transport and reveal the essential mechanism forlow-dimensional materials applied in thermal management.

Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains