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We report on the application of a feedback-controlled electromigrationtechnique for the formation of nanometer-sized gaps in mesoscopic gold wiresand rings. The effect of current density and temperature, linked via Jouleheating, on the resulting gap size is investigated. Experimentally, a goodthermal coupling to the substrate turned out to be crucial to reach electrodespacings below 10 nm and to avoid overall melting of the nanostructures. Thisfinding is supported by numerical calculations of the current-density andtemperature profiles for structure layouts subjected to electromigration. Thenumerical method can be used for optimizing the layout so as to predeterminethe location where electromigation leads to the formation of a gap.

Two-dimensional simulations of temperature and current-density distribution in electromigrated structures