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The diffusion bonding of commercially pure Cu/Ni was made to diffuse at different bonding conditions allowing the bonding to proceed across the planar interfaces. The mechanism, microstructure and mechanical properties which are the effects of diffused bonding were studied. The Nondestructive Ultrasonic C-scan testing method was used to characterise the bond interface. The area of fraction bonded, and its reflection coefficients were computed using ultrasonic C-scan images to determine the quality of bonding. The inferences arrived based on nondestructive testing were checked by conventional destructive test methods which were well correlated. The SEM micrograph was used to compute the interface line width of the diffused bond. The EDS was used to study the mapping of elemental distribution and the fractured surface area of the diffused bonded joints.

Mechanical and ultrasonic characterisation of copper-nickel diffusion bonded joints