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In this work, a novel Cu–UiO-66/wood composite was successfully fabricated by a facile in situ growth strategy, and the influence of Cu–UiO-66 metal-organic framework (MOF) loading on the wood substrate thermal stability and flame retardancy were investigated. Scanning electron microscopy images indicated that the octahedral Cu–UiO-66 microparticles were uniformly and firmly decorated on the lumen surface within the balsa wood scaffold. The incorporation of only 6.5 wt% Cu–UiO-66 MOF remarkably enhanced the thermal stability and flame retardancy of the natural wood. Compared with the untreated wood, the peak heat release rate of the Cu–UiO-66/wood composite exhibited a drastic decline by 73.1% from 94.5 to 25.4 W·g −1  and the total heat release from 7.7 to 5 kJ·g −1 . Meanwhile, the treated wood had a strong self-extinguishing ability and the char residue rate of the Cu–UiO-66/wood is significantly increased by 132.7%. Therefore, this work provided an effective means of achieving the fire safety wood via introducing and constructing Cu–UiO-66 MOF flame retardants material.

In-situ growth of metal-organic framework (Cu–UiO-66) within wood scaffold for improved flame retardancy