English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Tools annual

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Presents the access of premium content as premium feature

Premium Content

Global: Zendy Plus annual

Global: Zendy Free Plan

The dynamic anti-plane response of a bi-material half space including a circular hole and periodic interfacial cracks is investigated. An analytical model is established for periodic type III cracks that adopt the idea of “conjunction” modeling. The definite integral equations suitable for modeling the existence of multiple interfacial cracks are derived that satisfy the continuity conditions at the interface. Numerical calculations are carried out to find the dynamic stress concentration factor (DSCF), whose results indicate that the number of interfacial cracks has a significant effect on the dynamic stress concentration around the hole edge, especially for low-frequency incident SH waves.

Scattering of SH waves in a bi-material half space with a circular hole and periodic type III interfacial cracks