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Cu-Al 2 O 3  composite materials combining the good electrical of copper matrix and the high hardness of Al 2 O 3  ceramic particles show great performance in electronics, electrical sliding contacts fields. However, the relationship of a dilemma between strength and ductility has become a limitation for the development of copper matrix composites. The previous works indicated that fine grain powders can improve interfacial bonding between the copper matrix and Al 2 O 3  particles to further enhance strength while maintaining ductility. In the present work, the multiscale-alumina particles reinforced copper matrix composites were successfully fabricated by mixing high-energy ball milling and consolidation of hot-press sintering. SEM and TEM were used to observe the powder morphology and microstructure of Cu-Al 2 O 3  composites. The results show that the reinforcing phase Al 2 O 3  particles are uniformly dispersed in the copper matrix, which improves interfacial bonding between the copper matrix and Al 2 O 3  particles. Especially, the micro Al 2 O 3  particles play an important role in achieving an excellent tradeoff of strength and ductility in the Cu-Al 2 O 3  composite. In addition, the microhardness of Cu-Al 2 O 3  composites can be greatly improved by using the high-energy ball milling and hot-press sintering process. The research idea of this paper can provide a reference for other composite materials that need to improve mechanical properties.

Fabrication of Multiscale-Alumina Particles Reinforced Copper Matrix Composites with High-Energy Ball Milling and Hot Pressing