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Fabrication, characterization, and thermomechanical reliability of electroplated Cu-Sn-Cu-based transient liquid phase (TLP) bonding required in microsystems packaging are reported. Die-level bonding was achieved using 8-μm-thick electroplated copper pillars covered with 2-μm tin. A mechanical test specimen having rectangular ring-shaped structures was fabricated to measure the strength of Cu-Sn joints. An electrical test vehicle having 250 copper pillars connected in a daisy chain series was designed. The effect of bonding force, temperature, and durations on the shear strength and electrical resistance of the Cu-Sn-Cu joints were investigated. The mechanism behind the improved bonding at higher force, temperature, and duration is reported. Samples bonded at a lower bonding force (5 kg) failed, while those bonded at a higher force showed good strength. A complete transformation of Sn into stable Cu 3 Sn was essential to achieve good bonding. Due to the presence of Cu 3 Sn IMC, the bonding strength of samples bonded at higher temperatures and longer duration was higher. Thermal shock and humidity tests were conducted to check the long-term reliability of Cu–Sn–Cu bonded joints. The percentage change in the electrical resistance of a complete daisy chain remained &lt;5% even after 1000 thermal shock cycles.

Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging