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The present study is based on the numerical analysis of the thermal behavior around multilayers electronic component’s interfaces. These components are increasingly miniaturized and receive constantly growing powers. These operating conditions cause serious thermal problems, which can lead to a progressive degradation of their performances and decrease their duration life. In multilayer electronic structures, this alteration is translated by delamination phenomenon in the interface contact regions. In order to detect damages on multilayers electronic components, we propose to follow the evolution of the thermal contact resistance between layers in the transient phase. To do this, we identify the thermal contact resistance by inverse heat conduction method from temperature measurements.

Identification of the thermal contact resistance in transient regime to detect the phenomenon of delamination in multilayer electronic devices