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This paper outlines the detailed study on the imperfections, which are commonly associated with the realization of Radiofrequency Micro-Electro-Mechanical System (RF-MEMS) devices. It also includes empirical modeling of each phenomenon. These imperfections have been broadly categorized into two major classes: fabrication related and another is linked with IC assembly/packaging method. The thorough study deciphers the insight device physics embedded with all those fabrication and packaging issues in MEMS devices. Individual modeling of these issues gives a clear picture of their impacts on device performances.

Investigation of Various Commonly Associated Imperfections in Radiofrequency Micro-Electro-Mechanical System Devices and its Empirical Modeling