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The Ni-5 at.%W/Ni-9.3 at.%W/Ni-5 at.%W alloy composite substrate with a thickness of 109 μm was produced by powder metallurgy and rolling process. The composite substrates with different thicknesses were produced by electrochemically polishing the outer layer of each substrate. When the thickness of the composite substrate was reduced to 72 μm, the cubic texture could still reach 97.3% by using electron backscatter diffraction. Moreover, its saturation magnetization only reached 2.3 (emu/g). Finally, the cubic texture of composite substrates was found to vary in thickness thinning because the grain growth mechanism between the inner and outer layers is different. The inner layer defect has a “pin” effect on grain boundary migration, and in the outer layer, the cubic grain grows more easily to the surface and along the rolling direction. However, the formation of cubic-oriented grains is hindered by the twin defects in the inner layer.

Strong cube texture formation of Ni5W/Ni9.3W/Ni5W composite thin substrates for YBCO-coated conductors